本SAC耦合设备适用于阵列半导体泵浦激光器的SAC自动化生产，可全自动装配半导体激光器SAC。
OC-S1000 is applicable to the automated production of array semiconductor pump lasers, realizing fully automatic assembly of SAC for semiconductor lasers.
由于SAC外形尺寸微小，加上SAC短的焦距，使得人工装配变得极为困难，很容易损伤到半导体芯片，而该自动化系统则完美地解决了这一现实问题。
Due to the tiny overall dimension and short focal length of SAC components, manual assembly is highly difficult and may easily damage semiconductor chips. This automated system perfectly solves this practical problem.
本SAC耦合设备能够实现自动对芯片加电、图像识别自动夹取SAC、自动定位SAC、自动点胶和固化、自动将数据保存到数据库内。
It supports automatic chip power supply, vision recognition-based automatic SAC picking, automatic SAC positioning, automatic dispensing and curing, as well as automatic data storagein the database.
