TP500-D是针对半导体产品基板贴装芯片研发的全自动高精度固晶设备。适用于芯片固晶生产工艺，可兼容多种上下料方式，具有自动贴片等功能。
TP500-D is a fully automatic high-precision die bonder designed for chip mounting on semiconductor substrates. It is suitable for chip die bonding production processes, supports various loading and unloading modes, and features automatic die attaching function.
运用 AI 算法迭代，芯片基板上下料采用配方功能，通过算法配方更换不同芯片与基板的组合，能便捷切换贴片组合。
It adopts iterative AI algorithms and supports recipe-based loading and unloading for chips and substrates. Different combinations of chips and substrates can be swiftly switched via process recipes for flexible production changeover.
设备主体为大理石结构，运动部件采用高精度直线电机、伺服电机与光栅尺闭环控制，保障运动系统高精度稳定运行。
The machine features a marble main frame. Its moving parts are driven by high-precision linear motors and servo motors with grating scale closed-loop control, ensuring high-precision and stable operation of the motion system.
