泵浦源共晶贴片机 TP1000（Pump Sourse Eutectic Die Bonder）

TP1000用于COS激光芯片贴装到LD管壳的生产，兼容多种贴装工艺，具有共晶加热温控平台、自动贴片、配置真空回流焊接炉等功能。

TP1000 is used for mounting COS laser chips onto LD packages. It is compatible with multiple mounting processes, and is equipped with eutectic heating temperature control platform, automatic die attaching function and built-in vacuum reflow soldering furnace.

设备以大理石为主体结构，使用高精度的视觉定位机构及高灵敏度的压力控制机构，可达到高精度、高稳定性的贴片效果。

The equipment adopts marble main structure, equipped with high-precision visual positioning mechanism and high-sensitivity pressure control mechanism, which realizes die attaching with high precision and excellent stability.