TP1000用于COS激光芯片贴装到LD管壳的生产，兼容多种贴装工艺；具有自动上下料、共晶加热温控平台、自动贴片、配置真空回流焊接炉等功能。本设备以大理石为主体结构，使用高精度的视觉定位机构及高灵敏度的压力控制机构，可达到高精度、高稳定性的贴片效果。

TP1000 is designed for the assembly of COS laser chips onto LD packages, compatible with multiple mounting processes. It features automatic loading and unloading, a eutectic heating and temperature-controlled platform, automatic die bonding, and is equipped with a vacuum reflow soldering oven. With marble as its main structure, this equipment utilizes high-precision visual positioning mechanisms and high-sensitivity pressure control mechanisms to achieve high-precision and high-stability die bonding effects.

基于人工智能AI算法迭代，可实时检测贴片效果，同时可实现芯片基板上下料采用配方功能，通过算法配方搭配更换不同芯片与基板间的组合，可以快捷方便地更换不同的贴片组合；

Based on iterative AI algorithms, it can detect the die bonding effect in real-time. Additionally, it incorporates a recipe function for chip and substrate loading and unloading, allowing for quick and convenient switching between different chip and substrate combinations through algorithm recipes.

可配置精密电动摆台控制加热平台倾斜角度。根据管壳芯片安装面的倾斜度，将整个加热台沿Y轴旋转，保证芯片安装面与贴装吸嘴平行；

It can be equipped with a precision electric turntable to control the tilt angle of the heating platform. Depending on the inclination of the chip mounting surface of the package, the entire heating platform can be rotated along the Y-axis to ensure that the chip mounting surface is parallel to the mounting nozzle.

管壳上下料采用左进右出的拨料推动方式，操作方便，方便设备联机及加装管壳自动弹舱平台。

The package loading and unloading adopt a left-in, right-out pusher mechanism, facilitating easy operation, equipment networking, and the installation of an automatic tube shell ejection platform.