AOI-DFN030是针对芯片的外观缺陷检查，所开发的多面检测设备。

AOI-DFN030 is a multi-faceted inspection equipment developed specifically for detecting external defects on chips.

设备以高精密运动平台为核心，采用 AI深度算法智能引擎，依托公司多年的缺陷检测领域积累，设备具有高素质的成像能力，独有的AI算法高效识别缺陷、全种类的自由缺陷学习氛围、全场场景的生产信息界面，多工艺融合的产品配置场景，大容量的远程离线复判系统，定制化的MES系统对接等优势。

Centered around a high-precision motion platform, the equipment employs an AI deep learning algorithm smart engine. Building upon the company's years of experience in defect detection, this equipment boasts high-quality imaging capabilities, unique AI algorithms for efficient defect recognition, a comprehensive learning environment for all types of defects, a production information interface covering all scenarios, product configuration scenarios integrating multiple processes, a large-capacity remote offline re-inspection system, and customized MES system integration, among other advantages.

本设备支持常用芯片的缺陷检测，包括检测脏污、破损、裂纹、划痕、区域异色、图形异常、尺寸异常等外观瑕疵，检测范围包含正面、背面，两个侧腔面。         This equipment supports defect detection for commonly used chips, including the detection of external flaws such as dirt, damage, cracks, scratches, discoloration in specific areas, graphical anomalies, and dimensional irregularities. The inspection covers the front, back, and both side cavity surfaces.

特别是光通信芯片领域，脊区生长异常、金属层气泡、脊区损伤等特殊类型瑕疵成像和检出效果明显优于同品类产品。

Especially in the field of optical communication chips, the imaging and detection effects for special types of defects such as abnormal ridge growth, metal layer bubbles, and ridge damage are significantly superior to those of similar products.