TP300-PLUS是奥创普针对半导体产品单颗基板共晶贴装多颗芯片研发的全自动智能共晶贴片设备。
TP300-PLUS is a fully automatic intelligent eutectic die bonder independently developed by UPI Tech for single-substrate eutectic mounting of multiple semiconductor chips.
适用于光通讯芯片共晶贴片生产工艺，兼容多种上下料方式，具有固后检测、自动贴片等功能。运用 AI 算法迭代，可实时检测贴片效果，芯片基板上下料采用配方功能，通过算法配方更换不同芯片与基板的组合，能便捷切换贴片组合。
It is applicable to the eutectic die bonding production process of optical communication chips and supports multiple loading and unloading methods, featuring post-bonding inspection and automatic die attaching functions.Equipped with iterative AI algorithms, it enables real-time inspection of die bonding quality. Recipe functions are adopted for chip and substrate loading/unloading; different combinations of chips and substrates can be quickly switched via algorithm recipes for flexible production conversion.
工艺上，基板上下料可选料盒平铺或蓝膜方式，芯片上料可选料盒平铺、蓝膜。设备主体为大理石结构，运动部件采用高精度直线电机、伺服电机与光栅尺闭环控制，保障运动系统高精度稳定运行。
In terms of process, substrates can be fed and unloaded via tray flat placement or blue tape, while chips support tray flat placement and blue tape feeding. The main body adopts marble structure, and moving components are driven by high-precision linear motors and servo motors with grating ruler closed-loop control, ensuring high precision and stable operation of the motion system.
