TP300 Pro是针对半导体产品单颗基板同时共晶贴装多个小微芯片研发的全自动智能共晶贴片设备。

TP300 Pro is a fully automatic intelligent eutectic bonding machine specifically developed for the simultaneous eutectic mounting of multiple microchips onto a single substrate of semiconductor products.

适用于 COC/COS 芯片共晶贴片生产工艺，兼容多种上下料方式，具有上料检测、上料及焊后COC/COS检测、自动贴片等功能。

It is suitable for the eutectic bonding production process of COC/COS chips, compatible with various loading and unloading methods, and features functions such as loading detection, post-welding COC/COS detection, and automatic chip placement.

运用 AI 算法迭代，可实时检测贴片效果，芯片基板上下料采用配方功能，通过算法配方更换不同芯片与基板的组合，能便捷切换贴片组合。自带单管供料检测，对芯片正面、背面、端面进行检测，合格芯片直供贴片模组。

Utilizing iterative AI algorithms, it can detect the placement effect in real-time. The loading and unloading of chip substrates utilize recipe functions, allowing for convenient switching between different chip and substrate combinations through algorithm recipes. It comes with a single-tube feeding detection system that inspects the front, back, and end faces of the chips, with qualified chips being directly supplied to the placement module.