TP-EB5001全自动共晶贴片机是一款兼容多种上下料方式、单管四面检测、全自动共晶贴片的多功能机型。
TP-EB5001 is a multifunctional model that is compatible with multiple loading and unloading methods, single-tube four-side inspection, fully automatic eutectic die bonding.
自带单管供料检测功能，对于单管正面、背面、端面进行检测，检测合格的芯片直接供料到贴片模组进行贴片，还具备选配功能，可自主选择供料（单管）检测部分；
Comes with a single-tube supply inspection function, which can detect the top side, bottom, and end faces of a single tube. Qualified chips are directly supplied to the patch module for bonding, it also has an optional function, you can independently select the supply (single-tube)inspection part.
人工智能AI算法迭代，可实时检测贴片效果，同时可实现芯片基板上下料采用配方功能，通过算法配方搭配更换不同芯片与基板组合，更加快捷方便的更换不同的贴片组合；
Artificial intelligence Al algorithm iteration can detect the chip placement effect in real-time, while achieve the function of using formula for chip substrate loading and unloading. By matching the algorithm formula with different chip and substrate combinations, different bonding combinations can be replaced more quickly and conveniently.
设备以大理石为主体结构，并具备高精度的视觉定位机构及高灵敏度的压力控制机构，可实现高精度、高稳定性的贴片效果。
The equipment takes marble as the main structure, and has high-precision visual positioning mechanism and high-sensitivity pressure control mechanism, which can achieve high-precision and high-stability bonding effect.
