光通信 Optical Communication 大功率激光 High-power Laser |
| 晶圆检测设备 AOI-W1009-AL (Wafer Inspection Machine) |
| 900mm(L)×1500mm(W)×2100mm(H) |
| 芯片多面检设备 AOI-DFN1001(Chip Multi-Side Inspection Machine) |
| 1710mm (L) x1250mm (W) x1980mm (H) |
| 芯片单面检设备 AOI-DF1016(Chip Single-Side Inspection Machine) |
| 1200(L)×1200mm(W)×2150mm(H) |
| COC多面检测清洗设备 AOI-COC1500 (COC Multi-Side Inspection and Cleaning Machine) |
| 1950mm (W) x1250mm (L) x1900mm (H) |
| 多功能检测设备 AOI-TH1010(Multifunctional Inspection Machine) |
| 1750mm (L) x1100mm (W) x1900mm (H) |
| 多模态模块检测设备 AOI-JX1504(Multimodal Module Inspection Machine) |
| 1900mm(L)×1200mm (W)×1800mm(H) |
| COS多面检测设备 AOI-TZ1512-QX(COS Multi-Side Inspection Machine) |
| 1200mm (L) x1150mm (W) x2150mm (H) |
| BAR条检测设备 AOI-TZ1513( BAR Inspection Machine) |
| 1200mm (L) x1150mm (W) x2150mm (H) |
光通信 Optical Communication 大功率激光 High-power Laser 先进封装 Advanced Packaging |
| 多芯片共晶贴片机 TP-EB5006 (Multi-chip Eutectic Die Bonder) |
| 2320mm(L)×1680mm(W)×2000mm(H) |
| 全自动高精度固晶机 TP-DB5009(Fully Automatic High Precision Die Bonder) |
| 2480mm(L)×1450mm(W)×2000mm(H) |
| 全自动共晶贴片机 TP-EB5001(Fully Automatic Eutectic Die Bonder) |
| 2000mm(L)×1150mm(W)×2100mm(H) |
| 泵浦源固晶贴片机 TP-DB5004(Pump Sourse Die Bonder) |
| 2450mm(L)×2150mm(W)×2250mm(H) |
| 全自动共晶贴片机 TP-EB5001(Fully Automatic Eutectic Die Bonder) |
| 2000mm(L)×1150mm(W)×2100mm(H) |
| 泵浦源固晶贴片机 TP-DB5004(Pump Sourse Die Bonder) |
| 2450mm(L)×2150mm(W)×2250mm(H) |
| 全自动陶瓷片导电轨贴片机 TP-AD5005(Fully Automatic Ceramic Chip Conductive Rail Mounter) |
| 1650mm(L)×2250mm(W)×1950mm(H) |
| 高精度倒装固晶机 TP-DB5007(High-precision Flip Chip Die Bonder) |
| 2350mm(L)×1800mm(W)×2000mm(H) |
光通信 Optical Communication 大功率激光 High-power Laser |
| Lens&TRX-FA兼容耦合设备 OC-CC2009(Lens&TRX-FA Compatible Coupler) |
| 1200mm (L) x1000mm (W) x2000mm (H) |
| 双工位单透镜耦合设备 OC-CSL2013-D(Dual-station Single Lens Coupler) |
| 1200mm (L) x1000mm (W) x2000mm (H) |
| TRX耦合设备 OC-CTRX2010(TRX Coupler) |
| 1200mm (L) x1000mm (W) x2000mm (H) |
| 全自动共晶贴片机 TP-EB5001(Fully Automatic Eutectic Die Bonder) |
| 2000mm(L)×1150mm(W)×2100mm(H) |
| 泵浦源固晶贴片机 TP-DB5004(Pump Sourse Die Bonder) |
| 2450mm(L)×2150mm(W)×2250mm(H) |
| 全自动FAC高精度耦合机 OC-F1000(Fully Automatic FAC High-precision Coupler) |
| 1200mm (L) x1000mm (W) x2050mm (H) |
| 全自动SAC高精度耦合机 OC-S1000(Fully Automatic SAC High-precision Coupler) |
| 1200mm (L) x1000mm (W) x2050mm (H) |
| 全自动MIRROR高精度耦合机 OC-M1000(Fully Automatic MIRROR High-precision Coupler) |
| 1400mm(L)* 1100mm(W)*2050mm(H) |
| 全自动主光路耦合机 OC-P1000(Fully Automatic Main Path Coupler) |
| 1400mm (L) x1100mm (W) x2150mm (H) |
| 高速COS测试机 AX-TE50-E (High-speed COS Chip Tester) |
| 1350mm(L)×1350mm(W)×1850mm(H) |
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